Eric Chason Source Confirmed
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Researcher
John Brown University
faculty
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Biography and Research Information
OverviewAI-generated summary
Dr. Eric Chason's research focuses on the mechanics of metals and thin films, with applications in electronic packaging, semiconductor materials, and related areas. His work encompasses both experimental and modeling approaches to understanding the behavior of thin films under various conditions. Recent studies have investigated the microstructural and stress evolution in sputtered nickel thin films, the impact of processing conditions on stress in transition metal nitrides, and stress induced by energetic particle bombardment in molybdenum thin films using molecular dynamics simulations. Chason's investigations extend to the inter-relationship of stress and microstructure in tungsten films.
Metrics
- h-index: 50
- Publications: 261
- Citations: 10,849
Selected Publications
- Model for Thin Film Stress During the Early Stage of Island Coalescence (2025) DOI
- In Situ Measurement of Evolution of Biaxial Elastic Modulus of Sn Electrodes in Li-Ion Batteries (2023) DOI
- Analysis of Stress in Sputter-Deposited Films Using a Kinetic Model for Cu, Ni, Co, Cr, Mo, W (2022) DOI
- (Invited) Understanding Residual Stress in Thin Films through a Kinetic Model (2022) DOI
- Inter-Relationship of Stress and Microstructure in BCC and 'Beta' Tungsten Films (2022) DOI
- Analysis of Stress in Sputter-Deposited Films Using a Kinetic Model for Cu, Ni, Co, Cr, Mo, W (2022) DOI
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