Eric Stang Source Confirmed
Affiliation confirmed via AI analysis of OpenAlex, ORCID, and web sources.
Researcher
John Brown University
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Biography and Research Information
OverviewAI-generated summary
Eric Stang is a graduate student at John Brown University whose research encompasses a diverse range of topics, from electronic packaging and soldering technologies to spacecraft design. His materials science interests are reflected in studies of semiconductor interfaces, intermetallics, and advanced alloy properties. Recent work includes investigation into the creep behavior of lead- and tin-based solder materials. Stang also contributed to the development of a high-speed cryogenic thermal imager with on-chip frame memory. His work demonstrates an interest in calibration and measurement techniques.
Metrics
- h-index: 1
- Publications: 2
- Citations: 4
Selected Publications
- Constant Strain-Rate Garofalo Creep Behavior of Intermediate 83Pb/10Sb/5Sn/2Ag and 91.5Sn/8.5Sb Solder Materials (2024) DOI
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